In the first part, we take a binding restriction, called qualification, present in semiconductor manufacturing as a lever for increasing flexibility and optimizing capacity utilization. A qualification determines the processing authorization of a product on a machine (like an eligibility constraint). In order to define the best qualification, the production volume should be allocated to parallel non-identical machines which are partially reconfigurable. Capacitated flexibility measures are introduced to define the best qualification which increases machine capacity utilization at most. Batching is another industrial constraint encountered in semiconductor industry. It influences workload balancing and qualification management. Several workload balancing algorithms are proposed to find the optimal workload balance of a workcenter. Variability measures are also proposed to evaluate the workload variability of a workcenter. The second part deals with closed-loop production planning. Soitec uses Smart-Cut Technology to fabricate SOI wafers. Using this technology, one of the two raw materials used to fabricate SOI wafers can be reused several times to make other SOI wafers. However, before coming back to the SOI fabrication line, the used raw material (by-product) must be reworked in another production line. An original closed-loop production planning model adapted to the supply chain specificities of Soitec is proposed, and is validated using industrial data. Based on this industrial model, a single-item uncapacitated closed-loop lot-sizing model is defined, analyzed, and a dynamic programming algorithm is proposed for a simplified version of the problem.